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PrefaceChapter 1: Contamination and Contamination ControlSurface Cleaning Challenges for Organic Light Emitting DiodesCharacterization and Removal of Metallic Contamination in H2O and H2O2 Using Single Particle Inductively Coupled Plasma Mass SpectrometryDirect Analysis of Ultra Trace Metallic Particles in NH3 and HCl Gases by Gas Exchange Device (GED)-ICP-MSInvestigation of Contaminants in Single Wafer Wet Cleaning Using Isopropyl AlcoholCl-Containing Microplastics from the EnvironmentExperimental Wafer Carrier Contamination Analysis and Monitoring in Fully Automated 300 mm Power Production LinesWafer Container Monitoring Concerning Airborne Molecular Contaminations along a 300 mm Power Semiconductor Production FlowChapter 2: FEOL: Surface Chemistry and Etching of Group IV SemiconductorsTowards Si-Cap-Free SiGe Passivation: Impact of Surface Preparation on Low-Pressure Oxidation of SiGeWet Chemical Cleaning of Organosilane MonolayersReaction Kinetics of Poly-Si Etching in TMAH SolutionSurface Chemistry and Nanoscale Wet Etching of Group IV Semiconductors in Acidic H2O2 SolutionsSi1-XGeX Selective Etchant for Gate-All-Around TransistorsChapter 3: FEOL: Surface Chemistry and Etching of III-V Compound SemiconductorsGaN MOS Structures with Low Interface Trap DensityAnalysis of Surface Reaction for Group III-V Compound Semiconductors in Functional WaterEffect of Surface Oxidation on the Material Loss of InGaAs in Acidic SolutionsCharacterization of Wet Chemical Atomic Layer Etching of InGaAsChapter 4: FEOL: Etch Dielectric Films and Removal of Masking FilmsHighly Selective Etching between Different Oxide Films by Vapor Phase CleaningSilicon Corrosion during Selective Silicon Nitride Etch with Hot Diluted Hydrofluoric AcidKinetic Study on the Si3N4 Etching in Superheated WaterChallenges and Solutions of Replacement Metal Gate Patterning to Enable Gate-all-Around Device ScalingRemoval of SOC Hard Mask for Patterning of Work Function Metal by Thermally Activated Ozone GasHigh Performance, Eco-Friendly SPM Cleaning Technology Using Integrated Bench-Single Wafer Cleaning SystemChapter 5: Wet Processing in Narrow Spaces and Pattern CollapsePolydimethylsiloxane Micro-Channels Application for the Study of Dynamic Wetting of Nano-Etched Silicon Surfaces Based on Acoustic Characterization MethodCharacterization of Wetting of Deep Silica Nanoholes by Aqueous Solutions Using ATR-FTIREffect of Hydrophobicity and Surface Potential of Silicon on SiO2 Etching in Nanometer-Sized Narrow SpacesFormulation and Evaluation of Diluted Sulfuric-Peroxide-HF (DSP+) Mixtures for Cleaning High-Aspect Ratio Contacts in 3D NANDNew Test Structure Development for Pattern Collapse EvaluationsBreakthrough of Sublimation Drying by Liquid Phase DepositionChapter 6: Fundamentals of Megasonic AgitationEstimation of the Generation Rate of H· Radicals in a Megasonic Field Using an Electrochemical TechniqueVisualization of Acoustic Waves and Cavitation in Ultrasonic Water FlowSimulation of Rayleigh Bubble Growth near a No-Slip Rigid WallEffect of Surfactant in Gas Dissolved Cleaning Solutions on Acoustic Bubble DynamicsInteraction between Free-Surface Oscillation and Bubble Translation in a Megasonic Cleaning BathChapter 7: Particle RemovalStudy on Uniform Deposition on 300 mm Silicon Wafer with Sub-100 nm Sized Particles for Cleaning ApplicationUltrafine Particle Removal in the Wafer Cleaning Process Using an Aqueous Solution with a High Concentration of Dissolved O3 and HFParticle Removal in Ultrasonic Water Flow Cleaning Role of Cavitation Bubbles as Cleaning AgentsScalable Particle Removal for sub-5 nm NodesThe Effect of Thermal Aging on Nano-Particle RemovalChapter 8: Post-CMP CleaningContact Vs. Non-Contact Cleaning: Correlating Interfacial Reaction Mechanisms to Processing Methodologies for Enhanced FEOL/BEOL Post-CMP CleaningEffect of Viscosity on Ceria Abrasive Removal in the Buffing CMP ProcessNodule Deformation of PVA Roller Brushes on a Rotating Plate: Optimum Cleaning for Nanosized Particles due to Liquid Absorption and Desorption of Sponge DeformationMechanism of PVA Brush Loading with Ceria Particles during Post-CMP Cleaning ProcessTribological Characterization of Anionic Supramolecular Assemblies in Post-STI-CMP Cleaning Solution Using a Novel Post-CMP PVA Brush ScrubberEffect of Dissolved Oxygen on Removal of Benzotriazole from Co during a Post-Co CMP CleaningChapter 9: BEOL CleaningRemoval of Post Etch Residue on BEOL Low-K with NanoliftCopper Catalysis Effect Investigation for TiW Etch Process on Patterned WafersSelective Nickel Platinum Removal without Titanium Nitride Metal Gate CorrosionRoughness and Uniformity Control during Wet Etching of MolybdenumEffect of Surface Chemistry on Ruthenium Wet EtchingSelective Ru or Co Etch for 3nm ApplicationsRemote Plasma Etching of Backend Semiconductor Materials for Reliable Packaging